Networking/Consumer Electronics

Mainboard thermal source section is modeled as a single thermal resistance.

Preliminary design: Use the two fan models provided by the client, 3004 and 3007. The casing is slightly simplified, and screws, interfaces, and certain components of the mainboard are excluded from the simulation scope. 

Preliminary design: Use the two fan models provided by the client, 3004 and 3007. The casing is slightly simplified, and screws, interfaces, and certain components of the mainboard are excluded from the simulation scope. 

Simulation Parameters:

1. Ambient temperature: 50°C, no external wind.
2. Thermal interface material: 6W.
3. Thermal power dissipation as shown in the figure below.
4. Inlet and outlet ventilation hole opening ratio: 60%.

Diameter: 59.5mm
Material: Aluminum substrate (Series 1)
Heat Power Consumption: 220W
Ambient Temperature: 35℃

Diameter: 59.5mm
Material: Aluminum substrate (Series 1)
Heat Power Consumption: 220W
Ambient Temperature: 35℃